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Japan
Electromagnetic Professional (EMPro) is a new design platform for analyzing the electromagnetic effects of RF and microwave components such as high-speed IC packages, antennas, on-chip and off-chip embedded passives and PCB interconnects. EMPro features the most modern design, simulation and analysis environment, highest capacity simulation technology and integration with the industry’s leading RF and microwave circuit design environment, Advanced Design System (ADS) for fast and efficient RF and microwave circuit design.

The EMPro platform incorporates the industry’s best proven architecture of user interface and simulation technologies to relieve designers of time spent setting up, simulating and post processing results, leaving more time for innovation and creating the best design possible.
Key Features of EMPro's modern platform:
Click on each of the blue headings below to view short videos (no audio) detailing the features of EMPro.
Import and parameterize complex 3D CAD designs such as a complete cell phone to start multiple EM simulations over a family of geometries to find the optimal structure without long repeated manual set up for each simulation..
Assign material properties to imported or drawn 3D objects only once by simple drag and drop from an extensive material database onto the 3D objects to set up EMPro simulation..Once assigned, the material properties are memorized for subsequent CAD imports for even faster simulation setup.
Interactive 3D drawing, with intuitive context-sensitive on-screen cues, prompt you where you can drag and edit the structure without the constant need to move your eyes off the drawing to select menu picks and dialog boxes. Hot keys further enable you to complete the 3D drawing quickly in a natural flow according to your thought process.
Parameterization of geometry is directly achieved by replacing any dimension with an equation variable, the value of which can further depend on multiple other variables. This allows linked geometry sweeps or the drawing of mathematically defined curved surfaces for antennas. Even the location of the stimulus feed to any component or antenna can be parameterized to find the optimal feed point.
Adaptive meshing follows the shape of your critical components to always deliver the best accuracy and convergence It is even active during parameterized sweeps.to ensure the most accurate and robust simulation possible.
When a simulation is running you can view dynamic real time plots of intermediate results to provide early insights and allows for interruption to adjust the geometry before restarting again. This eliminates long simulations of non-performing designs.
Simulations setup has build-in intelligence to launch simulations correctly with minimal user input but still gives full control if needed.
Intuitive setup of field sensor locations enable far fields, Specific Absorption Rate (SAR), and Hearing Aid Compatibility (HAC) analysis to be all done efficiently in a single time-sweep
Then EMPro’s multi-threaded and accelerated postprocessing offer immediate viewing of simulation results, This is unlike traditional 3DEM simulators where post processing the results can take as long as the simulation itself.
Linux and Windows Integration
Linux and Windows support allows you to run EMPro on a wide variety of computers and operating systems of your choice.
ADS Integration

EMPro sets itself apart from other EM tools through its innovative integration with the industry’s leading RF and microwave circuit design platform, Agilent’s Advanced Design System (ADS). ADS RF designers can import EMPro parameterized 3D components for EM simulation and optimization in ADS. Because the parameterized 3D component is created just one time and integrates with both EMPro and ADS, error prone links between today’s standalone 3DEM point tools and ADS are eliminated, resulting in faster design and assured accuracy.
Additionally, ADS circuit designers can transfer their layout from ADS into EMPro to accurately determine effects such as conformal bending of a planar antenna around a curved product package or effectiveness of metal shielding.
EMpro’s 3D parameterized components such as connectors, solder ball arrays, packages or any custom components can be transferred into ADS as a library for use in 3D-EM co-simulation and co-optimization with circuit and system components, enabling evaluation of complete family of structures in one step.
 
ADS circuit designers can transfer layout files into EMPro to accurately account for the 3D proximity effects of shielding, product packaging or the conformal bending of a planar antenna inside it.
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