RF System-in-Package/Module - Publications and Examples

Designers of RF System-in-Package (SiP) and RF Modules can use various tools in Advanced Design System (ADS) at both the circuit level and the system level. The variety of simulation technologies available in ADS enables designers to complete the design from concept to a final product with ease. Also the breath and depth of Electro-Magnetic (EM) simulation technologies Agilent EEsof offers allows RF SiP/Module designers to achieve first pass design success.

Additional design support is provided by a growing number of examples and training classes, and by Agilent EEsof EDA technical support.

Click on any of the links on this page to learn more about examples and products using EDA tools from Agilent EEsof EDA.