Momentum RF Mode - New EM Simulation Engine
There's a new "RF mode" for Momentum. In addition to the full-wave
solver of Momentum, the RF mode incorporates a quasi-static solver, arbitrary polygonal
mesh, and a star-loop basis function, which dramatically reduces simulation time and
increases capacity without loss of accuracy for structures under a half wavelength.
The RF mode is suitable for wireless applications, such as ball grid array packages,
interconnects, and complex RF printed circuit boards.
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For complete information on Momentum, including Momentum RF Mode, click on the following link:
Momentum Planar Electromagnetic Simulator
Model Composer
Model Composer enables you to create multi-dimensional, parameterized models for passive planar components. The unique and patented modeling method is EM-based, thus providing EM accuracy and generality at circuit simulation speed. Model types include standard interconnect components such as opens, stubs, bends, and tees on custom substrates.
The generated models are fully compatible within Advanced Design System and include both a schematic and layout representation, as well as an electrical model. Components can be created in libraries, logical groupings, or sets of components.
Model Composer is available without charge to supported Linear Simulator owners and can be downloaded from the Agilent EEsof EDA technical support software downloads area:
Software Downloads
For details on the E8881A Linear Simulator click on the following link:
E8881A Linear Simulator
Circuit Simulation and Models
DC Simulation
Improved convergence and saves results for faster RF simulation
Transient-assisted Harmonic Balance
Improved HB convergence using transient simulation results. New
tabs in the HB controller write final transient solutions for use as initial estimates.
SDD Simulation Speed Improvement
Simulation time for SDDs is now comparable to user-compiled models.
Noise Improvement
FM mixer noise simulation now conforms to the IEEE definition,
which includes noise generated by the input termination at all frequencies.
New Bondwire Model
Computes self- and mutual- inductance of bondwires
based on location and shape.
Device Model Enhancements
- HSPICE ACM Parameters - adds geometry parameters to BSIM3 model
- HSPICE Diode Model - has additional temperature coefficients
- Philips MOS Model 30 and 9 V903 update
- EEFET3 Temperature Enhancements
- BSIMSOI Model
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RFIC Design Flow Integration
Increased Compatibility with SPICE Simulators
- Multiplicity factor support
- L Model card support
- Global power rails
- Improved SPICE netlist translator including new documentation
- Improved IFF translation and import speed
Device Model Binning
This increases compatibility between ADS and other
third-party SPICE simulators. "Binning" is defined as providing several
model cards for a device, which can represent different geometries,
temperatures, or other properties.
ADS selects appropriate model card for each instance,
depending on parameter value (length, width, temperature, and so on) input
by the user.
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Design Filter Tool and Synthesis Enhancements
Digital Filter Designer now has a link to the Agilent
ESG-D signal generator. It also has been updated for FIR phase specification
and contains a wizard for generalized (root) raised cosine filter design.
The DSP Synthesis tool has new fixed-point synthesizable
library parts, including Xilinx 4000e and Virtex FPGAs, as well as additional
modulators, interpolators, and comb filters.
Behavioral Synthesis Engine Update
Support for chaining to produce higher throughput designs
has been added. Increased usability is provided by allowing specification of
fixed throughput goals.
It is now easier to control Synthesis by designating average
wire delays, as well as register setup and hold timings.
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