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“Our P2 process was developed specifically for WLAN power amplifiers. A foundry design kit is offered as an extension to our foundry services. In the competitive WLAN landscape, time-to-market translates into market share. The idea here is to help our customers achieve first pass design success with minimal design iteration for 802.11 a, b & g applications. In addition to the P2 process, GCS also offers several other qualified InGaP HBT processes (P1 for WCDMA PA, P5 for GSM PA, P6 for infrastructure gain blocks, and D1 for high-speed digital circuits). GCS will continue to roll out the design kits for these processes throughout the remainder of 2003.” |
— Dr. Owen Wu, Founder and Chief Strategic Officer, GCS |
The InGaP HBT P2 design kit was developed in collaboration between GCS and Agilent Technologies and it provides a complete set of schematics, simulation models, and layout artwork for both active and passive elements. The active device models include both Gummel-Poon and VBIC formats, which provide designers with greater flexibility in design. Measured S-parameter files are also included as part of the design kit. Designers can create layout using a series of fixed artwork and Parameterized Artwork Macros (based on the use of Agilent's Graphical Cell Compiler and Application Extension Language). The implementation of the GCS design kit in the ADS environment allows customers immediate access to the innovative P2 process.
Company Profile
Global Communication Semiconductors, Inc., based in Torrance, California, an ISO 9001-2000 certified company, provides pure-play III-V compound semiconductor foundry services to the the wireless telecommunication and high-speed networking industries. GCS currently offers foundry services for InGaP HBT, InP HBT and PHEMT processes and provides optoelectronic foundry services for QWIP detectors, modulators & PIN diodes used in the surveillance, security and fiber optic communication markets.
GCS employs many engineers and technicians with strong backgrounds in semiconductor process and devices. Collectively, our key technologists have more than 300 years of experience in InGaP HBT, InP HBT, PHEMT and III-V optoelectronics such as detectors and lasers.
GCS currently has a capacity of 500 4-inch wafers per week and will soon expand capacity with a 6-inch facility.
Global Communication Semiconductors, Inc.
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