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Archive - EEsof Asia Tech Forum 2004

Strengthening the High-Frequency Design Chain with Agilent EEsof EDA
Asia, 13 - 23 April 2004

Today's RF and microwave designers face significant challenges due to the advances in device and semiconductor technology, the evolution of RF/microwave technology from military systems to consumer-oriented wireless applications.

At Agilent EEsof EDA, we believe that today�s designs require the application of multiple technologies, multiple design teams, multiple design flows and cooperation among them all for the design chain to be strong enough to lead to product success. The links in the design chain must be well managed and interactive, or the chain will break, resulting in missed deadlines, cost over-runs and lost business.

We are pleased to invite you to our �Strengthening the High Frequency Design Chain with Agilent EEsof EDA� seminar in Asia. The seminar focuses on the High Frequency Design Chain that is provided by Agilent EEsof EDA and our industry partners. We will discuss:

Generate your own RF IP or integrating 3rd party IP into your system-level design.
Generate signals and performing simulations in EDA software and measurements in instruments for emerging and proprietary standards.
Achieving design success for RF SiP(System-in-Package), MMIC, and signal integrity in high-speed applications.
Demo LTCC design processes using ADS and the DuPont 943 Green Tape^TM Design Kit.
Show how easily designers can comfortably enter the 3D world with the link between ADS and CST MICROWAVE STUDIO.

Locations, Dates, and Registration

Seoul/Korea	Tuesday 13 April 2004 Chrysanthemum Room, Grand Intercontinental Hotel Registration: Call to Korea Call Center at 82-2-2004-5004
Taipei/Taiwan	Thursday 15 April 2004 National Taiwan University (NTU), Taipei.
Hsinchu/Taiwan	Friday 16 April 2004 National Chiao Tung University (NCTU), Hsinchu.
	Registration for Taipei and Hsinchu events: 1. Call toll free 0800-047-866 and indicate the campaign code, MC#7781. or 2. Web: http://www.agilent.com.tw/find/events or 3. E-Mail: `tm_taiwan@agilent.com` and indicate the campaign code, MC#7781.
Singapore	Monday 19 April 2004 Marina Mandarin Singapore, Raffles Boulevard Les Oiseaux Room (Level 5) Registration: Call toll free 1 800-375 8100.
Beijing/China	Wednesday 21 April 2004 Beijing Jing Lun Hotel 2nd Floor, Bai He Function Room I/II
XiAn/China	Friday 23 April 2004 Xian Sheraton Hotel 2nd Floor, Function Room I
	Registration for Beijing and XiAn events: Call toll free 800-810-0189, campaign code is MC7916.

Papers

Agilent Technologies, System-Level Design & Verification Using ADS Behavioral Modeling. 56 slides. PDF, 1.3 MB.

Agilent Technologies, Flexible RF Test Bench for Emerging or Proprietary Standards. 25 slides. PDF, 1.6 MB.

Agilent Technologies, What's New in the Last Four Releases of the Advanced Design System. PDF, 53 slides. 2.8 MB.

Hee Soo Lee, Agilent Technologies, RF System in Package Design in ADS. 58 slides. PDF, 5.8 MB.

Glenn Oliver, DuPont Electronic Technologies, RF System-in-Package Design: New Tools and Methods for LTCC. 45 slides. PDF, 20.6 MB.

Agilent Technologies, Increasing MMIC Yield with Advanced Statistical Design Methods. 77 slides. PDF, 777 KB.

Agilent Technologies, Designing Signal Integrity into your High-Speed Wireless Applications. 41 slides. PDF, 1.5 MB.

Marko Walter, CST GmbH, The link between Agilent's ADS and CST's MWS: Entering the 3D EM world with CST MICROWAVE STUDIO®. 40 slides. PDF, 10.6 MB.