| Products |
| Agilent EEsof EDA products that support RF System-in-Package (SiP) and RF Module design include the following: |
| DesignGuides |
| DesignGuides for Advanced Design System guide you through
complex multi-step design flows and automate the setup, simulation,
and data display of complete designs. |
| Application Guides |
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| Contact Agilent EEsof EDA |
| To contact an Agilent Technologies representative by telephone for help with Product Selection and Product Purchase, click on the following link: |
| • Sales |
| To send an e-mail message to Agilent EEsof EDA, click on the following link: |
| • Send E-mail to Agilent EEsof EDA |
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| Examples |
| Project files in the Examples directory of Advanced Design System are described in the online manual and listed in the Examples Documentation. |
| Project files that show RF System-in-Package (SiP) and RF Module design include the following: |
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RF System-in-Package/Module
• RF System-in-Package Bandpass Filter
• LTCC modeling and design example: GreenTape 943 Material System
• Physical Layout Connectivity Check
EM / Circuit Co-Simulation
• EM/Circuit Co-Simulation with a LTCC low pass filter
• EM\Circuit Co-simulation with 1GHz LNA
Baluns
• Balun Simulation
• X-Band Balun
Time Domain Reflectometry
• Microstrip Step Discontinuities
• Time-Domain Reflectometry
Support Examples
Support examples can be found in the
Agilent EEsof Knowledge Center.
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| Online Demos and Tech Info Sessions |
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| | Training Classes |
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| Agilent Publications and Links |
| 2007 - 2006 |
| • | Hee Soo Lee, Agilent Technologies, RF/SiP Module Design Verification Flow in ADS. 56 slides. PDF, 6.4 MB. Technical Paper |
| • | Dean Nicholson, Agilent Technologies, Bondwire and Edge Effect Modeling in Microwave Components Using ADS and EMDS, 58-slides. PDF, 1.1 MB. Technical Paper |
| ADS 2004A Design Applications Seminar, Europe, September and October 2004 |
| • | Multi-layer laminate and LTCC RF System-in-Package Design in ADS. PDF, 9.2 MB. |
| Strengthening the High-Frequency Design Chain with Agilent EEsof EDA, Asia Technical Forum, 13 - 23 April 2004 |
| • | Hee Soo Lee, Agilent Technologies, RF System in Package Design in ADS. 58 slides. PDF, 5.8 MB. |
| • | Glenn Oliver, DuPont Electronic Technologies, RF System-in-Package Design: New Tools and Methods for LTCC. 45 slides. PDF, 20.6 MB. |
| • | Agilent Technologies, Designing Signal Integrity into your High-Speed Wireless Applications. 41 slides. PDF, 1.5 MB. |
| Seminar: Gaining the Wireless Edge, November 2000 |
| • | Packaging of Wireless Components. (PDF, 3.0 MB) |
| • | Modeling Physical PCB Effects. (PDF, 2.4 MB) |
| 1999 EM Seminar |
| • | Momentum Optimization: Moving from Analysis to Design Automation. (PDF, 2.6 MB) |
| • | Passive Model Library Generator: Creating Custom Parameterized Circuit Models. (PDF, 2.2 MB) |
| Other Publications |
| • | RF System-in-Package (SiP) Design in ADS 16-slide technical presentation, with speaker's notes (PDF, 1.2 MB). |
| • | Tom Dhaene, Agilent Technologies, and Daniel De Zutter, University of Antwerp, Belgium, Automated Circuit Modeling Tool for Arbitrary Passive Microwave and RF Component. 3-page technical paper/contributed talk, SCEE 2002: Scientific Computing in Electrical Engineering, Eindhoven, The Netherlands, June 2002. (PDF, 50 KB). 24 June 2002. |
| • | Luc Knockaert, et al., Agilent EEsof EDA, Generalized Polygonal Basis Functions for the Electromagnetic Simulation of Complex Geometrical Planar Structures. (PDF, 123 KB). 4-page technical paper. |
| • | Agilent EEsof EDA, Inductance and Capacitance Modeling of RF Board and High Speed Package Interconnects based on Planar EM Simulation. (PDF, 142 KB). 12-page technical paper. |
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| Technical Articles and Links |
| • | Hee Soo Lee and Dean Nicholson, Agilent Technologies, RF SiP Design Verification Flow with Quadruple LO Down Converter SiP, High Frequency Electronics, May 2007, pages 20 - 28. Current issue: High Frequency Electronics
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| • | Hee Soo Lee (Agilent Technologies), Koon Shee, and Gustavo Leizerovich (Motorola Mobile Devices), Achieve First-Pass LTCC Design Success With DFM, Microwaves & RF, May 2007. Current issue: Microwaves & RF.
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| • | Dean Nicholson and Hee Soo Lee, Agilent Technologies, Characterization and modeling of bond wires for high-frequency applications, Microwave Engineering Europe, August/September 2006. PDF, 335 KB. Current issue: Microwave Engineering Europe.
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| • | Sonoko Akamatsu, Charles Baylis, and Dr. Larry Dunleavy, University of South Florida, Accurate Simulation Models Yield High Efficiency Power Amplifier Design, IEEE Microwave Magazine, December 2005. 23-page technical paper. (PDF, 244 KB)
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| • | Mark Rencher, Pivotal Enterprises, Forget SoCs: Ceramic modules still a preferred platform for RF mixed signal designs, EE Times Planet Analog, 12 August 2002. Current issue: EE Times Planet Analog.
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| • | Jinhua Wu, et al., Anadigics, Inc., RF SiP Technology: Integration and Innovation, GaAs MANTECH Online Digest, International Conference on Compound Semiconductor Manufacturing, 2004. Conference web site: GaAs MANTECH.
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| • | Douglas J. Mathews and Michael P. Gaynor, Amkor Technology, RF System in Package: Consideration, Technologies and Solutions, 8-page technical paper.
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| • | DuPontTM Microcircuit Materials, 943 Design Kit for Agilent ADS. Online data sheet.
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| • | C. P. Hung, et al., Advanced Semiconductor Engineering, Inc., 20 GHz Electrical Characterization and Limit of Organic BGA Packages With and Without Plating Stub. (PDF, 97 KB). 4-page technical paper, October 2002.
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| • | Tom Dhaene, et al., Agilent Technologies/INTEC - Ghent University, Constrained EM-based Modeling of Passive Components, IEEE Xplore, 4-page technical paper, Microwave Symposium Digest, 2002 IEEE MTT-S International, June 2002. Current Issue: IEEE Xplore.
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| • | John E. Penn, Johns Hopkins University Applied Physics Laboratory (APL), A Broadband, Four-bit, Ka-band MMIC Phase Shifter, Microwave Journal, December 2001. PDF Version (858 KB). Current Issue: Microwave Journal.
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